3. Subsequent analytical testing is to be performed to determine the presence and concentrations of extractables and leachables. DESCRIPTION: Current production systems are capital and labor intensive, making the powders inordinately expensive, especially for small batches. DESCRIPTION: The market for microelectronics that meet government radiation requirements is small. 465-540. https://doi.org/10.1364/AOP.8.000465. 3. In addition to threat detection, applications would also be applied to reduce current system false/nuisance alarm rates. 2.
), target type (e.g. Assess these candidate waveforms under a wide variety of objectives, targets, and environmental conditions. Please see note in Description section. One constraint associated with using data from air deployed sensors is the limited bandwidth of both the source and receiver (on the order of 100 Hz). Also in some situationse.g., fixed wing ditchaircrew can enter a raft without inflating the devices and save inflation for a more critical situation such as leaving the raft, for rescue, or capsize. TECHNOLOGY AREA(S): Materials; Sensors; Space Platform; Weapons
PHASE III DUAL USE APPLICATIONS: Phase III efforts will focus on transitioning the developed technology to a working commercial or warfighter solution. Also, command centers currently hand-fuse significant amounts of information from legacy data sources in order to complete day to day operational planning and C2; can these processes and information sources be integrated to increase effectiveness? It shall facilitate on-demand pico- and nanosecond gating between 200 pm to 100 ns, ideally, of both a pulsed laser source and the time-delayed return of reflected pulses off a far-field target. ; Jensen, E.D. These items may also require a qualification of a Representative Article. Long lifetime, triggered, spark-gap switch for repetitive pulsed power applications. Rev. PHASE II: Complete a detailed prototype design incorporating government performance requirements. Work produced in Phase II may become classified. The goal of this SBIR topic is to develop environmentally benign coatings that deter settlement without the release of biocides, are effective for five years or more, and are easy to clean should some biofouling occur. PHASE III DUAL USE APPLICATIONS: Demonstrate an integrated scene projection system for a specific application, including a functional projector control system and image generation capability. For each component of the framework that is not an encapsulation of an existing tool, a stub may be used as a placeholder for capabilities to be added in Phase II. 4. The Phase I effort will include prototype plans to be developed under Phase II. OBJECTIVE: Design and develop a multispectral scene projector capable of presenting a scene to a gimbaled sensor under test. 8x8 cm) substrates from boules grown in a thermally-stable Vertical Gradient Freeze (VGF) furnace. PHASE III DUAL USE APPLICATIONS: Collaborate with simulation model developer(s) and/or user(s) on integration of product(s) into a missile defense application. The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls dual use items. AIAAJ Aeronautics September 2019, Volume 57, Number 9. https://arc.aiaa.org/doi/abs/10.2514/1.J057869. (e) Snow
DESCRIPTION: This topic seeks innovative complex data science methods that go beyond traditional data analysis. This topic seeks to address these and other challenges at sub-scale levels in phase I and phase II and transition those technologies to a full-scale vehicle in Phase III. Develop regulatory strategy, and initiate interactions with the FDA. Washington, D. C.: DoD. TECHNOLOGY AREA(S): Sensors; Electronics; Space Platform; Nuclear; Weapons
RT&L FOCUS AREA(S): INFORMATION SYSTEMS
Demonstrate a prototype fully packaged receiver for direct insertion into analog fiber optic links.
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